Automated wet bench cleaning developed specifically for the semiconductor industry: reliable, repeatable cleaning and preparation of wafers and sensitive components, certified to SEMI standards with SECS-GEM integration.
The W200 is a wet bench tool designed to meet the stringent requirements of semiconductor manufacturing, providing a reliable and cost-effective solution for the cleaning and preparation of wafers and other sensitive components during production. Developed on the proven 200-series platform specifically for the semiconductor industry, it is certified to SEMI standards and integrates with the fab host through the SECS-GEM protocol.
A closed-loop cleaning system with integrated filtration minimises contamination risk, and batches are indexed through the process by a two-axis pick-and-place servo transporter with full process flexibility: any stage, in any order, with any combination of processes loaded in sequence. A choice of ultrasonic cleaning and rinsing frequencies matches the process to the substrate, the final rinse draws on integrated pure water generation, and full batch tracking and datalogging record every load for traceability.
The system is controlled by a Beckhoff PLC with full motion control integration, driven from a touchscreen interface running Unitech Shyre software optimised for simple operation. Complete diagnostic coverage reports any technical problem to the operator, auto-start brings the line up and down to a seven-day schedule, and sleep mode cuts power consumption between runs. An always-on secure VPN connection supports remote diagnostics, process support and software updates, and SECS-GEM integration brings control, monitoring and reporting into the fab host.
Wafer cleaning, tooling cleaning and semiconductor component cleaning in production environments. Its sister machine for precision optics and wider industrial cleaning is the PC200 precision cleaning system.
| Platform | Wet bench cleaning system developed on the 200-series platform specifically for the semiconductor industry |
|---|---|
| Certification | Certified to SEMI standards |
| Fab integration | SECS-GEM protocol: control, monitoring and reporting |
| Cleaning system | Closed loop with integrated filtration to minimise contamination risk; range of validated cleaning chemistries and processes |
| Ultrasonics | Ultrasonic cleaning and rinsing with a choice of frequencies |
| Water and effluent | Integrated pure water generation; integrated effluent treatment |
| Drying | Hot air, IR, vacuum or solvent drying options; ionised air showers; air knife blow off |
| Enclosure | Process stages enclosed by a sealed canopy pressurised with Class 100 clean-room quality air through a laminar-flow diffuser |
| Automation | Two-axis pick-and-place servo transporter; full process flexibility, any stage in any sequence |
| Construction | Stainless steel frame, fully bunded, with removable hinged access panels |
| Controls | Beckhoff PLC with full motion control; touchscreen HMI; auto-start scheduling; sleep mode |
| Support | Always-on secure VPN for remote diagnostics, process support and software updates |
| Data | Full batch tracking and datalogging; batch and status reporting; barcode or RFID reading options |
| Safety | Interlocked guards with dual-channel safety sensors to EN 13849; user login security |
| Specification | Agreed per configuration; full technical specification issued with each proposal |
Tell us your wafers or components, process chemistry and throughput target, and we will propose the right W200 configuration.
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